Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...
Patent
1986-11-25
1988-11-08
Bowers, Jr., Charles L.
Radiation imagery chemistry: process, composition, or product th
Diazo reproduction, process, composition, or product
Composition or product which contains radiation sensitive...
430194, 430197, 430325, 430330, 430167, G03C 171, G03C 172, G03C 152, G03C 170
Patent
active
047833912
ABSTRACT:
A radiation-sensitive composition is described, which is comprised of (1) a polymer containing repeating units of the formula: ##STR1## wherein R.sup.1 is a trivalent or tetravalent aromatic or heteroaromatic residue having 6 to 30 carbon atoms, R.sup.2 is a divalent aromatic or heteroaromatic residue having 6 to 30 carbon atoms, R.sup.3 is hydrogen or an ammonium ion, n is 1 or 2, and COOR.sup.3 is located in an ortho or peri position with respect to the amide linkage, (2) an organic compound having a radiation-dimerizable or radiation-polymerizable olefinic double bond and an amino radical or a quaternary ammonium salt, and (3) an aromatic monoazide compound [III] having no substituent or having a neutral or acidic substituent. This composition has a highly improved radiation sensitivity and the sensitive wavelength region of this composition is very broad. This composition can give a highly heat-resistant relief pattern with a good edge sharpness. Heat-resistant relief patterns obtained from this composition are especially useful as insulating passivation or protective coatings in semiconductor devices.
REFERENCES:
patent: 3595656 (1971-07-01), Ruckert et al.
patent: 4097283 (1978-06-01), Asano et al.
patent: 4243743 (1981-01-01), Hiramoto et al.
patent: 4424325 (1984-01-01), Tsunoda et al.
patent: 4451551 (1984-05-01), Kataoka et al.
patent: 4465768 (1984-08-01), Ueno et al.
patent: 4469778 (1984-09-01), Iwayanagi et al.
patent: 4547455 (1985-10-01), Hiramoto et al.
patent: 4608333 (1986-08-01), Ohbayashi et al.
Hiramoto Hiroo
Ohbayashi Gentaro
Umemoto Susumu
Bowers Jr. Charles L.
Miller Austin R.
Toray Industries Inc.
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