Radiation sensitive adhesive composition and method of photoimag

Details Radiation sensitive adhesive composition and method of photoimag Radiation sensitive adhesive composition and method of photoimag

1993-06-01

1995-01-03

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562757, 430270, B03C 194

Patent

active

053782984

ABSTRACT:
A method of photodelineating an adhesive on a substrate. The first step (10) is to coat the substrate with a layer of photopolymeric adhesive, typically spin coated. The adhesive is then briefly `soft baked` at a moderate temperature to set it (20). Portions of the adhesive are then selectively exposed to actinic radiation to partially cure them, while other portions are not exposed (30). A photomask is used to selectively expose the photopolymeric adhesive to ultraviolet light at an intensity and for a time sufficient to partially cure the photopolymeric adhesive. The adhesive is developed (40) to selectively remove those portions that were not exposed to radiation, usually in an appropriate solvent, creating a pattern in the adhesive. The developed adhesive pattern is then heated for a time and temperature sufficient to completely cure it (50).

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patent: 4966827 (1990-10-01), Sullivan
patent: 5263111 (1993-11-01), Nurse et al.

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