Radiation ray sensitive resin compostion containing at least two

Details Radiation ray sensitive resin compostion containing at least two Radiation ray sensitive resin compostion containing at least two

1996-07-08

1997-12-23

Young, Christopher G.

Radiation imagery chemistry: process, composition, or product th

Diazo reproduction, process, composition, or product

Composition or product which contains radiation sensitive...

430192, 430193, G03F 7023

Patent

active

057006202

ABSTRACT:
Disclosed is a radiation ray sensitive resin composition comprising a water-insoluble, alkali-soluble resin, a water-insoluble, alkali-soluble low-molecular compound and a radiation ray sensitive component, in which said radiation ray sensitive component contains a mixture composed of (A) a napthoquinonediazide sulfonic acid diester of water-insoluble, alkali-soluble low-molecular compounds having three and/or four phenolic hydroxyl groups and (B) a napthoquinonediazide sulfonic acid ester of a water-insoluble, alkali-soluble low-molecular compound having from 5 to 7 phenolic hydroxyl groups, in an amount of 30% or more of said radiation ray sensitive component. The composition is a positive type photoresist having a high resolution and small film thickness dependence. This has a broad latitude for development and leaves a small resist residue after development. This has high heat resistance and is therefore highly resistant to dry etching.

REFERENCES:
patent: 5340688 (1994-08-01), Kawabe et al.
patent: 5378586 (1995-01-01), Uetani et al.

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