Radiation protection for integrated circuits utilizing tape auto

Details Radiation protection for integrated circuits utilizing tape auto Radiation protection for integrated circuits utilizing tape auto

1981-07-13

1983-04-19

Ives, P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Edge feature

428458, 4284735, 428901, 174 685, 29840, B32B 2302, B32B 1508

Patent

active

043805663

ABSTRACT:
A technique is disclosed for protecting integrated circuits from alpha particles. A central portion of a radiation resistant insulating substrate upon which electrically conductive leads are disposed is positioned in proximity to the integrated circuit. When the leads are electrically connected to the integrated circuit, the central portion of the substrate is allowed to remain over the integrated circuit to protect the integrated circuit. The insulating substrate typically comprises a polyimide film resistant to alpha particles.

REFERENCES:
patent: 3700538 (1972-10-01), Kennedy
patent: 3801427 (1974-04-01), Morishita et al.
patent: 3940534 (1976-02-01), Fick et al.
patent: 4148969 (1979-04-01), Henderson
patent: 4254172 (1981-03-01), Takahashi et al.
T. G. O'Neill, "The Status of Tape Automated Bonding", Semiconductor International Feb. 1981, pp. 33, 34, 36, 38, 40, 42, 44, 46, 48, 50, 51.

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