Radiation imaging device and system

Details Radiation imaging device and system Radiation imaging device and system

2007-03-13

2007-03-13

Font, Frank G. (Department: 2883)

Radiant energy

Invisible radiant energy responsive electric signalling

Semiconductor system

C438S073000

Reexamination Certificate

active

10154264

ABSTRACT:
An x-ray and gamma-ray radiation energy imaging device has its semiconductor detector substrate and semiconductor readout/processing substrate both mounted on opposite sides of, and electrically communicating through, an intermediate substrate. The substrates are all substantially planar with the top plan perimeter of the semiconductor readout/processing substrate falling within the top plan shadow perimeter of the corresponding semiconductor detector substrate with which it electrically communicates. Additionally, all of the readout/processing circuitry contacts of the semiconductor readout/processing substrate are disposed on the surface of the semiconductor readout/processing substrate that electrically communicates with the intermediate substrate. Substantially all electrical communication to and from the semiconductor readout/processing substrate is routed through the intermediate substrate. The intermediate substrate is a printed circuit board or similar construct. The electrical contacts between the semiconductor substrates and the intermediate substrate are accomplished using bump-bonds, conductive adhesive bonds, conductive adhesive films or a combination thereof. One or two dimensional planar arrays of semiconductor readout/processing substrates and corresponding semiconductor detector substrates can be mounted on a single intermediate substrate using “tiling” techniques known in the art to form a mosaic radiation imaging device of increased active imaging area and reduced/minimized imaging dead area.

REFERENCES:
patent: 5245191 (1993-09-01), Barber et al.
patent: 5379336 (1995-01-01), Kramer et al.
patent: 5635718 (1997-06-01), DePuydt et al.
patent: 5734201 (1998-03-01), Djennas et al.
patent: 5786597 (1998-07-01), Lingren et al.
patent: 5812191 (1998-09-01), Orava et al.
patent: 5952646 (1999-09-01), Spartiotis et al.
patent: 6091070 (2000-07-01), Lingren et al.
patent: 6163028 (2000-12-01), Orava et al.
patent: 6194715 (2001-02-01), Lingren et al.
patent: 6323475 (2001-11-01), Spartiotis et al.
patent: 6356453 (2002-03-01), Juskey et al.
patent: 6426991 (2002-07-01), Mattson et al.
patent: 6465790 (2002-10-01), Monnet et al.
patent: 6510195 (2003-01-01), Chappo et al.
patent: 2001/0025928 (2001-10-01), Lingren et al.
patent: 2004/0178348 (2004-09-01), Wainer et al.
patent: 0421869 (1991-04-01), None
patent: 1162833 (2001-12-01), None
Mescher et al., “Application Specific Flip Chip Packages: considerations ans options in using FCIP,” Proc. Pan Pacific Microelectronics Symp. Conf., Jan. 2000.
Btechcorp, “ATTA(R) Anisotropic Electrically Conductive Film,” http://www.btechcorp.com/aecfmain.htm, May 2002.

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