Radiation imaging device

Radiant energy – Invisible radiant energy responsive electric signalling – Semiconductor system

Reexamination Certificate

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Details

C250S370010, C250S483100, C378S062000, C378S098800

Reexamination Certificate

active

07728303

ABSTRACT:
Wiring substrates11and12are positioned on a fixed base10in a manner such that there is a step between the wiring substrates, and radiation imaging elements2and3, respectively having scintillators25and35deposited on photosensitive portions21and31, are respectively mounted on the wiring substrates11and12. The radiation imaging element2is positioned so that its setting surface protrudes beyond a radiation incident surface of the radiation imaging element3, and the photosensitive portion21of the radiation imaging element2and the photosensitive portion31of the radiation imaging element3are juxtaposed to a degree to which the portions do not overlap. The photosensitive portion21of the radiation imaging element2extends close to an edge at the radiation imaging element3side and the scintillator25of substantially uniform thickness is formed up to this position.

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