Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Portion of housing of specific materials
Patent
1996-02-23
1999-12-07
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Portion of housing of specific materials
257659, 257660, 257788, 257789, 257790, 174104, 361816, H01L 2306, H01L 23552, H05K 900, H01B 718
Patent
active
059988673
ABSTRACT:
A shielding apparatus for an electronic component includes a first insulative encapsulant surrounding at least a portion of the component and a second encapsulant surrounding said first encapsulant and having conductive particles dispersed therein for absorbing ionizing radiation.
REFERENCES:
patent: 4639826 (1987-01-01), Val et al.
patent: 4717948 (1988-01-01), Sakai et al.
patent: 5021359 (1991-06-01), Young et al.
patent: 5153379 (1992-10-01), Guzuk et al.
patent: 5159629 (1992-10-01), Double et al.
patent: 5166772 (1992-11-01), Soldner et al.
patent: 5220192 (1993-06-01), Owens et al.
patent: 5324952 (1994-06-01), Cummings
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5406117 (1995-04-01), Diugokecki et al.
patent: 5436203 (1995-07-01), Lin
patent: 5635754 (1997-06-01), Strobel et al.
Jacobsen William F.
Jensen Ronald J.
Nguyen Toan Dinh
Spielberger Richard K.
Bruns Gregory A.
Clark Jhihan B.
Honeywell Inc.
Saadat Mahshid D.
LandOfFree
Radiation enhanced chip encapsulant does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Radiation enhanced chip encapsulant, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Radiation enhanced chip encapsulant will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-827172