Radiation-emitting component provided with metallic...

Details Radiation-emitting component provided with metallic... Radiation-emitting component provided with metallic...

2006-09-08

2010-06-01

Santiago, Mariceli (Department: 2879)

Electric lamp and discharge devices

With luminescent solid or liquid material

Solid-state type

C313S512000, C257S098000, C257S099000, C257S100000, C257S666000, C257S676000

Reexamination Certificate

active

07728507

ABSTRACT:
A process is specified for producing a radiation-emitting component comprising a housing body and a carrier for a radiation-emitting semiconductor body, in which the carrier is produced in an injection molding process from a molding compound containing a metal.

REFERENCES:
patent: 4179619 (1979-12-01), Cook
patent: 5689796 (1997-11-01), Kasai et al.
patent: 5963773 (1999-10-01), Yoo et al.
patent: 6274890 (2001-08-01), Oshio et al.
patent: 6900511 (2005-05-01), Ruhnau et al.
patent: 2003/0039571 (2003-02-01), Lim et al.
patent: 2003/0189830 (2003-10-01), Sugimoto et al.
patent: 2006/0284305 (2006-12-01), Yen et al.
patent: 102 29 067 (2004-01-01), None
patent: 10 2004 057 804 (2006-06-01), None
patent: 2003163381 (2003-06-01), None
German Search Report dated Apr. 11, 2007 for application No. 06019934.6-2122.
Frank Möllmer et al., “Siemens-SMT-TOP-LED-LEDs for Surface Mounting”,Siemens Components, vol. XXVI, No. 4-5, pp. 147-149 (1991).

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