Radiation-emitting and/or radiation-receiving semiconductor...

Details Radiation-emitting and/or radiation-receiving semiconductor... Radiation-emitting and/or radiation-receiving semiconductor...

2004-12-14

2010-02-23

Tran, Minh-Loan T (Department: 2826)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S100000, C257SE33059, C257SE23120

Reexamination Certificate

active

07666715

ABSTRACT:
A radiation-emitting and/or radiation-receiving semiconductor component comprising a radiation-emitting and/or radiation-receiving semiconductor chip, a molded plastic part which is transparent to an electromagnetic radiation to be emitted and/or received by the semiconductor component and by which the semiconductor chip is at least partially overmolded, and external electrical leads that are electrically connected to electrical contact areas of the semiconductor chip. The molded plastic part is made of a reaction-curing silicone molding compound. A method of making such a semiconductor component is also specified.

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Office Action Chinese Patent Application No. 200480032007.6 dated Sep. 14, 2007.
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