Radiant energy – Invisible radiant energy responsive electric signalling – Semiconductor system
Patent
1999-03-01
2000-10-17
Evans, F. L.
Radiant energy
Invisible radiant energy responsive electric signalling
Semiconductor system
257428, G01T 124, H01L 3100
Patent
active
061335746
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention is directed to a radiation-electrical transducer of the type having a luminophore that serves as carrier for at least one light-electrical transducer that is mechanically connected to the luminophore.
2. Description of the Prior Art
In X-ray technology, radiation-electrical transducers are employed that have a luminophore that converts the absorbed X-radiation into light, this light being converted into an electrical signal in a photosensitive transducer, for example, a photodiode. The overall transducer thus represents a detector for the received radiation intensity.
A scintillator can be provided as luminophore and a c-Si photodiode can be provided as photodiode.
German OS 30 09 723 discloses a transducer of the type initially cited. Nothing is stated about the type of light-electrical transducer and about the electrical contacting of the light-electrical transducer.
U.S. Pat. No. 4,734,588 also discloses a transducer that has a carrier on which a photodiode array together with the electrodes required for its electrical contacting is attached. Scintillators allocated to the individual photodiodes are glued to the photodiode array. The active sides of the photodiodes thereby face toward the scintillator or away from it dependent on the exemplary embodiment.
It is known from Tetsuhiko Takahashi et al., "Design of Integrated Radiation Detectors with a-Si Photodiodes on Ceramic Scintillators for Use in X-Ray Computed Tomography", IEEE Transactions on Nuclear Science, Vol. 37, No. 3, June 1990, pages 1478-1482, that both c-Si photodiodes as well as a-Si photodiodes can be utilized in radiation-electrical transducers.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a radiation-electrical transducer composed of a luminophore and a photodiode as simply as possible.
This object is inventively achieved in a transducer wherein the luminophore serves as carrier for at least one photodiode and for the contacts required for its electrical contacting. A separate carrier material, for example a substrate or a printed circuit board, can be omitted.
DESCRIPTION OF THE DRAWINGS
FIG. 1 is a side sectional view of a radiation-electrical transducer constructed in accordance with the principles of the present invention.
FIG. 2 is a view from below of a further version of the radiation-electrical transducer of FIG. 1.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
FIGS. 1 and 2 show a luminophore 1, particularly a ceramic scintillator, that carries a c-Si photodiode chip 2 on its underside. The photodiode chip 2 is joined to the luminophore 1 with the assistance of a transparent adhesive 3. The electrical contacting of the photodiode chip 2 ensues with the assistance of a contact layer 4 that produces a conductive connection from the photodiode chip 2 to contacts 5 of, for example, gold that are vapor-deposited on the luminophore 1. Proceeding from these contacts 5, which, for example, can be a matter of contact tracks, further electrical connection ensues with the assistance of, for example, gold wires in a way that is not shown.
The active side of the c-Si photodiode chip 2, i.e. that side that is light-sensitive as a result of corresponding method steps in the manufacture, for example diffusion processes, faces toward the luminophore 1. The contact layer 4 is fashioned as what is referred to as a contact bump that is electrically contacted to the contacts 5.
A module according to FIGS. 1 and 2 can be installed, for example, in computer tomography or in baggage scanners in a collimator. Such a module, however, is generally suited for all types of devices in which radiation is converted into electrical signals. In FIG. 1, the lines 6 indicate radiation, for example X-rays.
The photodiode chip 2 is formed by a matrix of photodiodes, whereby the contacts 5 are present in a corresponding number. It is also possible within the scope of the invention to connect only one photodiode to a luminophore in the disclosed way.
Although
REFERENCES:
patent: 4734588 (1988-03-01), Akai
patent: 5041729 (1991-08-01), Takahashi et al.
patent: 5629524 (1997-05-01), Stettner et al.
"Design of Integrated Radiation Detectors with a-Si Photodiodes on Ceramic Scintillators for use in X-ray Computed Tomography," Takahashi et al., IEEE Trans. on Nucl. Sci., vol. 37, No. 3 Jun.--1990, pp.1478-1482.
Evans F. L.
Siemens Aktiengesellschaft
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