Radiation cured, high temperature adhesive composition

Details Radiation cured, high temperature adhesive composition Radiation cured, high temperature adhesive composition

1978-03-03

1979-01-09

Turer, Richard B.

Chemistry: electrical and wave energy

Processes and products

Processes of treating materials by wave energy

2041592, 260 336UA, 260876B, 428461, 428483, 428508, 428511, 428515, 260 27BB, C08F 800

Patent

active

041337310

ABSTRACT:
A cured adhesive composition possessing excellent cohesive strength at high temperatures along with excellent adhesion, shear strength and solvent resistance is prepared by the radiation initiated curing of an adhesive composition comprising a monoalkenyl arene/conjugated diene block copolymer, tackifying resin and a di-to-tetra-functional acrylate or methacrylate selected from the group consisting of acrylic and methacrylic acid esters of polyols.

REFERENCES:
patent: 3113912 (1963-12-01), Kraus
patent: 3936365 (1976-02-01), Saunders et al.
patent: 4006024 (1977-02-01), Ibata et al.
patent: 4076768 (1978-02-01), Saunders et al.

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