Radiation-curable resin composition

Chemistry: electrical and wave energy – Processes and products – Processes of treating materials by wave energy

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Details

20415916, 20415919, C08J 328, C08L 6310, C08L 6706, C08L 7504

Patent

active

045252580

ABSTRACT:
A radiation-curable resin composition is disclosed. It comprises 0.1 to 10 parts by weight of a photosensitizer added to 100 parts by weight of a mixture of 40 to 95 wt % of a resin having a molecular weight of at least 300 and at least one ethylenically unsaturated group in the molecule and 60 to 5 wt % of .epsilon.-caprolactone modified 2-hydroxyethyl acrylate or methacrylate of the formula: ##STR1## wherein R=H or CH.sub.3 and

REFERENCES:
patent: 3700643 (1972-10-01), Smith et al.
patent: 4337289 (1982-06-01), Reed et al.

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