Radiation curable pressure sensitive adhesive composition

Details Radiation curable pressure sensitive adhesive composition Radiation curable pressure sensitive adhesive composition

1977-12-29

1978-09-05

Turer, Richard B.

Chemistry: electrical and wave energy

Processes and products

Processes of treating materials by wave energy

20415923, 260874, 260901, 427 44, 427 54, 427207B, 428355, 428425, 428480, C08F 800

Patent

active

041117697

ABSTRACT:
Radiation curable pressure sensitive adhesive composition comprises: a polyoxyalkylene homo- or copolymer which is either a polyoxyethylene homopolymer or a poly (oxyethylene - oxypropylene) copolymer, or mixture thereof, having a molecular weight of from 1,700 to 90,000, in which at least 40 percent by weight of the oxyalkylene units are oxyethylene units; a liquid carbamyloxy alkyl acrylate; and, optionally, a photoinitiator.

REFERENCES:
patent: 3479328 (1969-11-01), Nordstrom
patent: 3674838 (1972-07-01), Nordstrom
patent: 3956224 (1976-05-01), Chu
Steuben, K. C., "Radiation Curing Pressure Sensitive Adhesives: A/Literature Review", Adhesives Age, Jun., 1977, pp. 16-21.

Affiliated with

Also associated with

Rating

Radiation curable pressure sensitive adhesive composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Radiation curable pressure sensitive adhesive composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Radiation curable pressure sensitive adhesive composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2093979