Radiation-curable adhesive tape

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer

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Details

428354, 428355, 522 95, 522 96, 522117, B32B 712, C08J 328, C09J 702

Patent

active

052814734

ABSTRACT:
There is provided a radiation-curable adhesive tape comprising a radiation-curable adhesive layer which is formed on a radiation transmitting-substrate. The radiation-curable adhesive layer is composed of an acrylic adhesive and radiation-curable compound having carbon-carbon double bonds. The radiation-curable tape can be used preferably in processing steps for the production of semiconductor wafer, ceramics and glass employing a direct picking-up system.

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patent: 4773920 (1988-09-01), Chasman et al.
patent: 4965127 (1990-10-01), Ebe et al.
patent: 4999242 (1991-03-01), Ishiwata et al.
patent: 5149586 (1992-09-01), Ishiwata et al.
patent: 5187007 (1993-02-01), Ebe et al.

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