Radiation-curable adhesive tape

Details Radiation-curable adhesive tape Radiation-curable adhesive tape

1988-07-07

1991-03-12

Van Balen, William J.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

428354, 428355, 522117, B32B 712, B32B 1504, C08J 328

Patent

active

049992422

ABSTRACT:
There is provided a radiation-curable adhesive tape comprising a radiation-curable adhesive layer which is formed on a radiation transmitting substrate. The radiation-curable adhesive layer is composed of an acrylic adhesive and radiation-curable compound having carbon-carbon double bonds. The radiation-curable tape can be used preferably in processing steps for the production of semiconductor wafer, ceramics and glass employing a direct picking-up system.

REFERENCES:
patent: 4485226 (1984-11-01), Noll et al.
patent: 4640727 (1987-02-01), Janssen
patent: 4756968 (1988-07-01), Ebe et al.
patent: 4773920 (1988-09-01), Chasman et al.
Japanese Patent Application (OPI) 196956/1985.
Japanese Patent Application (OPI) 201642/1985.
Japanese Patent Application (OPI) 28572/1986.
Japanese Patent Application (OPI) 10180/1987.
Japanese Patent Application (OPI) 59684/1987.

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