Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-08-20
2001-10-16
Picard, Leo P. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S697000, C361S699000, C165S080300, C174S015200, C062S259200
Reexamination Certificate
active
06304441
ABSTRACT:
CLAIM OF PRIORITY
This application makes reference to, incorporates the same herein, and claims all benefits accruing under 35 U.S.C. §§119 from an application for A RADIATION APPARATUS FOR SEMICONDUCTOR IC APPARATUS AND PORTABLE COMPUTER WITH THE SAME earlier filed in the Korean Industrial Property Office on Aug. 20, 1998 and there duly assigned Serial No.
98-33776.
FIELD OF THE INVENTION
The present invention relates to a radiation apparatus for an integrated circuit semiconductor device and for a portable computer which can effectively radiate heat generated at the integrated circuit semiconductor device.
BACKGROUND OF THE INVENTION
Typically computer systems require a radiation apparatus for an integrated circuit semiconductor device. Such a radiation apparatus is used to radiate heat generated by a central processing unit (CPU) and is typically composed of a heat sink type.
For example, a heat sink is a block or plate which is made of a material that has an excellent heat conduction, such as aluminum or an aluminum alloy. Such a block or plate has fins as an assembly on its upper plane. Such a block or plate is for heat conduction and is attached, in contact with and connected to an upper surface of the central processing unit (CPU). When heat is generated while the central processing unit (CPU) is operated, generated heat is conducted to a heat sink and then removed through convection. However, the above-mentioned heat sink has some drawbacks, such as low heat removing efficiency.
Various attempts have been made to increase heat removing efficiency. For example, a fan has been added to the heat sink. Such a fan can convect generated heat through fins. Accordingly, the heat removing efficiency can be increased due to compulsory heat convection by the fan. However, there are also some problems with the fan, such as limited space for a fan to be established in the heat sink. Such problem associated with limited space is not compatible with a recent trend toward small-sized portable computers, such as notebook computers. In this regard, a notebook computer has little room for a fan.
Accordingly, there is strong need for a radiation apparatus which can efficiently radiate heat generated by the integrated circuit semiconductor device of a small-sized electronic system. Particularly, a radiation apparatus for a portable computer is needed which radiates more heat due to its larger central processing unit (CPU) volume in a slim electronic system.
SUMMARY OF THE INVENTION
It is an object among other objects of the present invention to provide a radiation apparatus for an integrated circuit semiconductor device which can effectively radiate heat generated by the integrated circuit semiconductor device mounted upon a circuit board of an electronic system.
It is another object of the present invention to provide a portable computer which can effectively radiate heat generated by an integrated circuit semiconductor device in a limited interior of a housing of a portable computer.
In order to attain the above objects and other objects of the present invention, according to an aspect of the present invention, there is provided a radiation apparatus for an integrated circuit semiconductor device mounted on a circuit board of an electronic system, the radiation apparatus includes a radiation member and a fan. The radiation member radiates heat generated by the integrated circuit semiconductor device, the radiation member being coupled to the integrated circuit semiconductor device. The fan exhausts or removes the heat, transferred from the integrated circuit semiconductor device through the radiation member, from the circuit board of the electronic system, the fan being arranged in parallel, spaced relation to the integrated circuit semiconductor device. The radiation member includes a radiation plate, a heat block and an assembly of first radiation fins. The radiation plate has an upper plane or first surface and a bottom plane or second surface and one end part thereof is located in opposing relation to the fan, and the heat block is in contact with an upper plane or first surface of the integrated circuit semiconductor device and coupled to the bottom plane or second surface of the radiation plate, transmitting the heat into the radiation plate, and the assembly of first radiation fins is located between the fan and the radiation plate and coupled to the radiation plate, and the fan having an air inlet on its upper plane or first surface.
The fan has an air outlet on one lateral plane or second surface to exhaust air introduced from the air inlet of the fan, and then air in the interior of the electronic system is exhausted out of the exterior of the electronic system via an air flow path between the air inlet on the upper plane or first surface of the fan and the air outlet on the one lateral plane or second surface of the fan.
The radiation member further includes an assembly of second radiation fins coupled to the upper plane or the first surface of one end part of the radiation plate to which the assembly of first radiation fins is coupled, and at least one heat pipe is located on the radiation plate and transmitting the heat into the radiation plate on which the fan is located. The at least one heat pipe is coupled to the bottom plane or the second surface of the radiation plate such that the at least one heat pipe is located on a lateral plane or first surface of the heat block.
According to another aspect of the present invention, there is provided a portable computer having a heat radiation apparatus. The portable computer includes a housing having a bottom plane or first surface, an upper plane or second surface and a plurality of lateral planes or third surfaces which define an interior space of the housing, a circuit board established on the bottom plane or the first surface of the housing, a receiving part located on the upper plane or the second surface of the housing and defining an opening or aperture passing into the interior space of the housing, a removable keyboard assembly having a plate and being established on the receiving part of the portable computer, an integrated circuit semiconductor device located on the circuit board through the opening or aperture of the receiving part of the portable computer, a radiation member for radiating heat generated by the integrated circuit semiconductor device, the radiation member being coupled to and being in contact with the upper plane or the first surface of the integrated circuit semiconductor device through the opening or aperture of the receiving part and being in contact with the plate of the removable keyboard assembly, and a fan exhausting air from the interior of the housing of the portable computer to an exterior of the housing of the portable computer, the fan being located under the radiation member and positioned near or on the bottom plane or first surface of the housing.
The radiation member includes a radiation plate having an upper plane or first surface and a bottom plane or second surface, and one end part of the radiation plate being located in opposing relation to the fan, and the upper plane or the first surface of the radiation plate being in contact with the plate of the keyboard through the opening or aperture of the receiving part, a heat block being in contact with the upper plane or the first surface of the integrated circuit semiconductor device and being coupled to the bottom plane or second surface of the radiation plate, the heat block transmitting the heat into the radiation plate, an assembly of first radiating fins being coupled to the bottom plane or second surface of the radiation plate on a part of the radiation plate positioned over the fan, an assembly of second radiating fins being coupled to an upper plane or first surface of one end part of the radiation plate to which the assembly of first radiation fins is coupled, and at least one heat pipe being coupled to the bottom plane or second surface of the radiation plate such that one end part of the at least one heat pipe is in con
Bushnell , Esq. Robert E.
Lea-Edmonds Lisa
Picard Leo P.
Sansung Electronics Co., Ltd.
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