Radiating structural body of electronic part and radiating...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S700000, C361S704000, C165S080300, C257S707000, C428S040100, C428S040400, C428S551000, C524S404000

Reexamination Certificate

active

07016196

ABSTRACT:
A heat dissipating structure for a heat generating electronic component is characterized by comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion stacked thereon between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member.

REFERENCES:
patent: 4230753 (1980-10-01), Sheyon
patent: 4299715 (1981-11-01), Whitfield et al.
patent: 4466483 (1984-08-01), Whitfield et al.
patent: 4473113 (1984-09-01), Whitfield et al.
patent: 4655768 (1987-04-01), Marecki et al.
patent: 4728572 (1988-03-01), Davis
patent: 5082595 (1992-01-01), Glackin
patent: 5162410 (1992-11-01), Sweet
patent: 5246997 (1993-09-01), Sweet
patent: 5352722 (1994-10-01), Sweet et al.
patent: 5482988 (1996-01-01), Ulman et al.
patent: 5504136 (1996-04-01), Davis et al.
patent: 5545473 (1996-08-01), Ameen et al.
patent: 5550326 (1996-08-01), Kesel
patent: 5590066 (1996-12-01), Ohki
patent: 5607721 (1997-03-01), Ulman et al.
patent: 5658975 (1997-08-01), Ulman et al.
patent: 5795834 (1998-08-01), Deeb et al.
patent: 5798171 (1998-08-01), Olson
patent: 5861211 (1999-01-01), Thakkar et al.
patent: 5876855 (1999-03-01), Wong et al.
patent: 5904796 (1999-05-01), Freuler et al.
patent: 5930893 (1999-08-01), Eaton
patent: 5945217 (1999-08-01), Hanrahan
patent: 5950066 (1999-09-01), Hanson et al.
patent: 6046907 (2000-04-01), Yamaguchi
patent: 6054198 (2000-04-01), Bunyan et al.
patent: 6090484 (2000-07-01), Bergerson
patent: 6165612 (2000-12-01), Misra
patent: 6183855 (2001-02-01), Buckley
patent: 6197859 (2001-03-01), Green et al.
patent: 6211276 (2001-04-01), Miyahara et al.
patent: 6227458 (2001-05-01), Dever et al.
patent: 6228965 (2001-05-01), Muta et al.
patent: 6255376 (2001-07-01), Shikata et al.
patent: 6343647 (2002-02-01), Kim et al.
patent: 6372997 (2002-04-01), Hill et al.
patent: 6391442 (2002-05-01), Duvall et al.
patent: 6399209 (2002-06-01), Misra et al.
patent: 6433057 (2002-08-01), Bhagwagar et al.
patent: 6451422 (2002-09-01), Nguyen
patent: 6530915 (2003-03-01), Eppstein et al.
patent: 6616999 (2003-09-01), Freuler et al.
patent: 6617517 (2003-09-01), Hill et al.
patent: 6644395 (2003-11-01), Bergin
patent: 6652705 (2003-11-01), Freuler et al.
patent: 6663964 (2003-12-01), Mita et al.
patent: 6671928 (2004-01-01), Huang
patent: 6764759 (2004-07-01), Duvall et al.
patent: 2003/0152764 (2003-08-01), Bunyan et al.
patent: 0 987 757 (2000-03-01), None
patent: 10-247708 (1998-09-01), None
patent: 97/41599 (1997-11-01), None
U.S. Appl. No. 10/250,683, filed Jul. 17, 2003, Mita et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Radiating structural body of electronic part and radiating... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Radiating structural body of electronic part and radiating..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Radiating structural body of electronic part and radiating... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3575138

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.