Radiant energy heating for die attach

Details Radiant energy heating for die attach Radiant energy heating for die attach

2007-03-06

2007-03-06

Nguyen, Cuong (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S684000, C257S738000, C257S778000

Reexamination Certificate

active

10947515

ABSTRACT:
Methods and systems for attaching a chip to a next level package by directing radiant energy at the chip back side while substantially preventing irradiation of the next level package are described.

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