Radial uniformity control of semiconductor wafer polishing

Details Radial uniformity control of semiconductor wafer polishing Radial uniformity control of semiconductor wafer polishing

1990-04-13

1991-08-06

Meislin, D. S.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51281SF, 51324, 51322, 511314, B24B 100, B24B 700

Patent

active

050366300

ABSTRACT:
Disclosed is an improved method of polishing a semiconductor wafer, which involves mounting the wafer to a wafer carrier comprising at least two materials having different coefficients of thermal expansion and regulating the temperature of the carrier, to thereby impart a convex (or concave) bias to the wafer. This provides an increased polishing action at the wafer center (or edges), so as to compensate for otherwise non-uniform radial polishing action across the wafer surface. Also disclosed, is an apparatus which incorporates the unique wafer carrier and temperature regulating means for achieving the desired degree of radial curvature of the wafer carrier.

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patent: 4313284 (1982-02-01), Walsh
patent: 4414286 (1983-11-01), Ty
patent: 4450652 (1984-05-01), Walsh
patent: 4517041 (1985-05-01), Hennenfent et al.
patent: 4637962 (1987-01-01), Albrecht et al.
patent: 4728232 (1988-03-01), Babel

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