Radial heat sink with helical shaped fins

Heat exchange – With retainer for removable article – Electrical component

Reexamination Certificate

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Details

C165S185000, C361S697000, C361S704000

Reexamination Certificate

active

06886627

ABSTRACT:
An electronic assembly includes an integrated circuit (e.g., a processor) mounted on a substrate (e.g., a motherboard), and a radial heat sink thermally coupled to the integrated circuit. The radial heat sink includes a core having an outer surface, and a plurality of helical fins that extend from the outer surface of the core. The electronic assembly may include a fan positioned near the heat sink. The appropriate angle for the helical fins relative to the longitudinal axis of the heat sink depends in part on the direction of the airflow that is produced by the fan.

REFERENCES:
patent: 3023264 (1962-02-01), Allison
patent: 3030292 (1962-04-01), Ludolf
patent: 3231477 (1966-01-01), Saunders et al.
patent: 5313099 (1994-05-01), Tata et al.
patent: 5397919 (1995-03-01), Tata et al.
patent: 6640882 (2003-11-01), Dowdy et al.
patent: 20020046826 (2002-04-01), Kao
patent: 20030048608 (2003-03-01), Crocker et al.
patent: 20030131970 (2003-07-01), Carter et al.
patent: 0833179 (1998-12-01), None

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