Radial folded fin heat sinks and methods of making and using...

Details Radial folded fin heat sinks and methods of making and using... Radial folded fin heat sinks and methods of making and using...

2001-09-10

2003-12-02

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165SDIG119, C165S185000, C165S121000, C257S722000

Reexamination Certificate

active

06657862

ABSTRACT:

TECHNICAL FIELD
This invention relates generally to radial fin heat sinks, and more particularly to radial folded fin heat sinks.
BACKGROUND
Integrated circuit devices (hereinafter “ICs”) and other types of electronic components, are becoming increasingly powerful as new features and capabilities are continuously being introduced. This is particularly true regarding the packaging of ICs on substrates, where each new generation of packaging must provide increased performance, particularly in terms of an increased number of components and higher clock frequencies, while generally being smaller or more compact in size. Because these powerful, yet tiny devices are experiencing a relatively large amount of electrical current flow within an extremely small area, a substantial amount of heat is generated during use. If this heat is not continuously removed, these devices may overheat, resulting in damage to the device, the entire system, and/or a reduction in operating performance. As a result, cooling devices are often used in conjunction with electronic components, assemblies and systems.
One commonly used cooling device is a heat dissipation device or heat sink cooling device. This device is normally secured to the top of the electronic component or assembly. In many instances, a fan is used in conjunction with the heat sink to aid in cooling. The heat sink portion of this device typically includes any number of vertically-oriented or prismatic cooling fins or rods that increase the surface area of the heat sink, thus maximizing the transfer of heat from the heat sink device into the surrounding air. The fan, which is typically mounted on top of the heat sink, causes air to move in a manner that helps to cool the fins or rods, thus enhancing their cooling effect. This fan-generated air flow is generally not filly utilized by the heat sink, however, thus limiting the amount of heat that can be removed from the fins or rods, thereby reducing the overall efficiency of the cooling device.
For the reasons stated above, and for other reasons stated below which will become apparent to those skilled in the art upon reading and understanding the present specification, there is a need in the art for a more efficient heat sink.


REFERENCES:
patent: 898107 (1908-09-01), Hill
patent: 2337294 (1943-12-01), Cooper
patent: 3182114 (1965-05-01), Burgess et al.
patent: 3187082 (1965-06-01), Allison
patent: 3466909 (1969-09-01), Weber
patent: 3779291 (1973-12-01), Yeo
patent: 4520541 (1985-06-01), Miki et al.
patent: 4557225 (1985-12-01), Sagues et al.
patent: 4688077 (1987-08-01), Wakabayashi et al.
patent: 4733293 (1988-03-01), Gabuzda
patent: 4997034 (1991-03-01), Steffen et al.
patent: 5132780 (1992-07-01), Higgins, III
patent: 5299090 (1994-03-01), Brady et al.
patent: 5375652 (1994-12-01), Matsunaga et al.
patent: 5437327 (1995-08-01), Chiou
patent: 5505257 (1996-04-01), Goetz, Jr.
patent: 5597034 (1997-01-01), Barker, III et al.
patent: 5661638 (1997-08-01), Mira
patent: 5761044 (1998-06-01), Nakajima
patent: 5777844 (1998-07-01), Kiefer
patent: 5785116 (1998-07-01), Wagner
patent: 5794685 (1998-08-01), Dean
patent: 5920458 (1999-07-01), Azar
patent: 5975194 (1999-11-01), Wagner
patent: 6069794 (2000-05-01), Chuang
patent: 6075702 (2000-06-01), Gardner et al.
patent: 6152214 (2000-11-01), Wagner
patent: 6176299 (2001-01-01), Hanzlik et al.
patent: 6189601 (2001-02-01), Goodman et al.
patent: 6196300 (2001-03-01), Checchetti
patent: 6208511 (2001-03-01), Bortolini et al.
patent: 6244331 (2001-06-01), Budelman
patent: 6360816 (2002-03-01), Wagner
patent: 6374490 (2002-04-01), Miyahara
patent: 6411510 (2002-06-01), Sasa et al.
patent: 6419007 (2002-07-01), Ogawara et al.
patent: 2001/0014011 (2001-08-01), Noriyasu et al.
patent: 2002/0017378 (2002-02-01), Hu
patent: 2002/0018336 (2002-02-01), Liang
patent: 2002/0046826 (2002-04-01), Kao
patent: 0856888 (1998-08-01), None
patent: 0860874 (1998-08-01), None
patent: 04-294570 (1992-10-01), None
patent: 406077677 (1994-03-01), None
patent: 2001/102504 (2001-04-01), None
“High-Performance Fin Design for a Fan-Mounted Heat Sink”,IBM Technical Disclosure Bulletin, IBM Corp. New York, vol. 37,NR. 11 ISSN: 0018-8689, 417-418 (Nov. 1994).
Schnurer, G. “Coole Typen Neue CPU-Kuehler Von Madex Und Titan”,CT Magazin Fuer Computer Technik.,Verlag Heinz Heise GMBH,Hannover,DE NR.11,82-83 (May 22, 2000).
Wagner, G. R., “Optimization of the Arcticooler for Lowest Thermal Resistance in a minimum Volume”,ITHERM 2000. 7TH Intersociety Conference on Thermal and Thermomrchanical Phenomena in Electronic Systems. Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, NY, IEEE, US ISBN: 0-7803-5913-5, (May/2000).

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