Radial bulk annular resonator using MEMS technology

Wave transmission lines and networks – Plural channel systems – Having branched circuits

Reexamination Certificate

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C239S204000, C372S083000, C372S061000, C356S624000

Reexamination Certificate

active

06894586

ABSTRACT:
A MEMS resonator includes an annular resonator body defined by an inner radius and an outer radius, a first electrode positioned within the inner radius and spaced from the resonator body, and a second electrode positioned around the annular resonator body and spaced from the outer radius. The first electrode and the second electrode provide for capacitive drive of the resonator body and capacitive sense of the resonator body. Piezo-resistive sense and piezoelectric drive/sense techniques can also be utilized. The overall extent can be smaller than 1 cm2in area and positioned on a supporting substrate by a plurality of anchors. The substrate can comprise an RF transceiver integrated circuit with the anchors connecting the drive electrode and sense electrode to the integrated circuit. The resonator is readily fabricated using conventional semiconductor integrated circuit fabrication techniques.

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Clark et al., “High-Q VHF Micromechanical Contour-Mode Disk Resonators,” Technical Digest, IEEE Int. Electron Devices Meeting, San Francisco, CA, Dec. 11-13, 2000, pp. 399-402.
Ki Bang Lee, Steve Ryder, and Liwei Lin, “Design and Fabrication of an Annular High Frequency Resonator,” Proceedings of IMECE'02, 2002 ASME, International Mechanical Engineering Congress & Exposition, IMECE2002-33387, New Orleans, Louisiana, Nov. 17-22, 2002.
Steve Ryder, Ki Bang Lee, Xiaofan Meng, and Liwei Lin, “Characterization of Out-of-Plane High Frequency Microresonators by AFM”, Technical Digest of the 12th Int'l Conference on Solid State Sensors, Actuators and Microsystems, Boston, Jun. 8-12, 2003.

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