Radial-biased polishing pad

Details Radial-biased polishing pad Radial-biased polishing pad

2007-08-14

2007-08-14

Rose, Robert A. (Department: 3723)

Abrading

Abrading process

With tool treating or forming

C451S527000, C451S041000

Reexamination Certificate

active

11392373

ABSTRACT:
The polishing pad is useful for polishing magnetic, optical and semiconductor substrates. The pad includes a polishing layer having a rotational center and an annular polishing track concentric with the rotational center and has a width. The width of the annular polishing track is free of non-radial grooves. And the pad has a plurality of radial micro-channels in the polishing layer within the width of the annular polishing track with a majority of the radial micro-channels having primarily a radial orientation and an average width less than 50 μm.

REFERENCES:
patent: 5081051 (1992-01-01), Mattingly et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5611943 (1997-03-01), Cadien et al.
patent: 5645469 (1997-07-01), Burke et al.
patent: 5785585 (1998-07-01), Manfredi et al.
patent: 5885147 (1999-03-01), Kreager et al.
patent: 5916010 (1999-06-01), Varian et al.
patent: 5938507 (1999-08-01), Ko et al.
patent: 6402883 (2002-06-01), Billett
patent: 6626743 (2003-09-01), Boyd
patent: 6767427 (2004-07-01), Walters et al.
patent: 6843711 (2005-01-01), Muldowney
patent: 2001/0006871 (2001-07-01), Moore
patent: 2004/0166785 (2004-08-01), Golzarian et al.
patent: WO 01/91969 (2001-12-01), None
Tseng et al.; “Comparison of Various Pad Conditioning Approaches—Simulation, Parameters Evaluation, and Discussion”, 1998 VMIC Conference, Jun. 16-18, pp. 518-520.

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