Ra-tab array bump tab tape based I.C. package

Details Ra-tab array bump tab tape based I.C. package Ra-tab array bump tab tape based I.C. package

1992-12-02

1994-12-20

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257688, 257734, 361761, 361774, 361792, 439 77, H05K 100

Patent

active

053750411

ABSTRACT:
An electronic package assembly that includes a flexible circuit wrapped around a metal substrate. The leads of the flexible circuit are connected to an integrated circuit that is mounted to the top surface of the substrate. The flexible circuit has a plurality of metal pads located adjacent to the bottom surface of the substrate. The flexible circuit also contains a power/ground plane and a number of conductive signal lines that couple the integrated circuit to the metal pads. The pads can be soldered to a printed circuit board to electrically couple the integrated circuit to the board.

REFERENCES:
patent: 4885126 (1989-12-01), Polonio
patent: 5166866 (1992-11-01), Kim et al.
patent: 5229916 (1993-07-01), Frankeny et al.
IBM Technical Disclosure Bulletin, "Flexible Leaded Chip Carrier", vol. 29, No. 11, Apr. 1987.
Research Disclosure, "Flexy-Pak--Three Dimensional Memory Package", Mar. 1990, No. 311.
IBM Technical Disclosure Bulletin, "Removal of Heat from Direct Chip Attach Circuitry", vol. 32, No. 4A, Sep. 1989.

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