R-F electrodes for removably providing electrical energy to an a

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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Details

118500, 118729, 118730, 156345, B05C 1300, C23F 102, C23C 1600

Patent

active

048820288

ABSTRACT:
An R-F electrode apparatus is provided featuring self-adjusting, spring biased electrodes, removably attached to a removable substrate holder, within a chamber used for plasma reactive treatment processes, particularly those involving semiconductor wafers. The apparatus further features base electrodes shaped and supported to insure uniform transmission of electrical energy during operation. The apparatus also provides an automatic means for wiping, self-cleaning action between the contact surfaces of opposing electrodes during introduction and removal of the substrate holder from the reaction chamber. The base electrodes are removably attached to standard electrical feedthroughs located in the reaction chamber wall, which lead to an external R-F power supply.

REFERENCES:
patent: 3907660 (1975-09-01), Gillery
patent: 4282077 (1981-08-01), Reavill
patent: 4424096 (1984-01-01), Kumagai
patent: 4448149 (1984-05-01), Brown, Sr. et al.
patent: 4610748 (1986-09-01), Engle et al.

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