Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1999-03-31
2000-10-31
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361700, 165 86, 16510433, G06F 120, H05K 720, F28D 1500
Patent
active
061412163
ABSTRACT:
A notebook computer has a base and a cover that is pivotally mounted to the base with a hinge. An integrated circuit chip is mounted to the base and has one end of a heat pipe attached to it or to an associated heat dissipation device. The other end of the heat pipe lies along the hinge. A spreader plate is mounted in the cover and attached to the other end of the heat pipe to form a nested, rotational joint. One end of the plate is located along the hinge and formed into a slotted cylinder. The heat pipe is pressed into the slot to form the joint which is tight around the heat pipe, but still allows it to rotate to accommodate the pivot motion of the cover. A retainer may be incorporated into the design to further enhance the strength of the joint and assure thermal continuity. The retainer is a hollow cylinder with an axial slit through which the plate extends.
REFERENCES:
patent: 3831664 (1974-08-01), Pogson
patent: 4345642 (1982-08-01), Ernst et al.
patent: 4500279 (1985-02-01), Devellian et al.
patent: 5513070 (1996-04-01), Xie et al.
patent: 5549155 (1996-08-01), Meyer, IV et al.
patent: 5588483 (1996-12-01), Ishida
patent: 5598320 (1997-01-01), Toedtman et al.
patent: 5621613 (1997-04-01), Haley et al.
patent: 5634351 (1997-06-01), Larson et al.
patent: 5646822 (1997-07-01), Bhatia et al.
patent: 5718282 (1998-02-01), Bhatia et al.
patent: 5725050 (1998-03-01), Meyer, IV et al.
patent: 5781409 (1998-07-01), Mecredy, III
patent: 5796581 (1998-08-01), Mok
patent: 5818693 (1998-10-01), Garner et al.
patent: 5822187 (1998-10-01), Garner et al.
patent: 5826645 (1998-10-01), Meyer, IV et al.
patent: 5835348 (1998-11-01), Ishida
patent: 5880929 (1999-03-01), Bhatia
patent: 5910883 (1999-06-01), Cipolla et al.
patent: 5975195 (1999-11-01), Lowry et al.
YO998-171 Computer Incorporating Heat Dissipator with Hinged Heat Pipe Arrangement for Enhanced Cooling Capacity.
Ho-lung Joseph Anthony
Kamath Vinod
Wong Tin-Lup
International Business Machines - Corporation
Magistrale Anthony N.
Picard Leo P.
Vortman Anatoly
LandOfFree
Quick-release hinge joint for heat pipe does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Quick-release hinge joint for heat pipe, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Quick-release hinge joint for heat pipe will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2060448