Stock material or miscellaneous articles – Composite – Of epoxy ether
Reexamination Certificate
2006-02-28
2006-02-28
Buttner, David J. (Department: 1712)
Stock material or miscellaneous articles
Composite
Of epoxy ether
C528S119000, C528S120000, C528S121000, C528S327000, C528S363000, C528S365000, C523S427000, C523S428000, C523S466000, C523S468000, C525S404000
Reexamination Certificate
active
07005185
ABSTRACT:
An epoxy composition includes an epoxy resin, a latent curing agent, and a catalyst. The composition includes two epoxide groups per molecule, and the latent curing agent is preferably a dicyanopolyamide, and most preferably dicyandiamide. The catalyst includes 2,4-toluene bis dimethyl urea, preferably in a concentration exceeding 70% by weight. The composition can be used in prepregs. The relative concentrations of the epoxy resin, curing agent, and catalyst are selected to achieve desired properties, including specific curing times and temperatures, and glass transition temperatures that enable a cured resin composition to be removed from a mold after being heated to its curing temperature, without being cooled. Exemplary formulations have reduced cure times, at both high and low curing temperatures, as compared to prior art formulations.
REFERENCES:
patent: 3386956 (1968-06-01), Nawakowski et al.
patent: 3660316 (1972-05-01), Scahefer et al.
patent: 3759914 (1973-09-01), Simms et al.
patent: 3945971 (1976-03-01), Harrison et al.
patent: 3956237 (1976-05-01), Doorakian et al.
patent: 3988257 (1976-10-01), Harrison et al.
patent: 4569956 (1986-02-01), Breitigam et al.
patent: 4775728 (1988-10-01), Goel
patent: 4783518 (1988-11-01), Goel
patent: 4859533 (1989-08-01), Seiya et al.
patent: 4931496 (1990-06-01), Qureshi et al.
patent: 5214098 (1993-05-01), Setiabudi et al.
patent: 5407978 (1995-04-01), Bymark et al.
patent: 5453453 (1995-09-01), Lamon et al.
patent: 5589523 (1996-12-01), Sawaoka et al.
patent: 5599629 (1997-02-01), Gardner et al.
patent: 0379172 (1990-01-01), None
patent: 0398700 (1990-11-01), None
patent: 0603131 (1993-12-01), None
patent: 0754741 (1997-01-01), None
patent: 0662488 (1999-11-01), None
patent: 54026000 (1979-02-01), None
patent: WO99/36484 (1999-07-01), None
Abstract, JP 54026000, Tokizawa et al., Feb. 1979.
Product Data Sheet for EPIKOTE 828 resin, Sep. 2002.
Product Information, D.E.N. 438, Oct. 2001.
Li Wei (Helen)
Miwa Kishio
Buttner David J.
Keehan Christopher
Morrison & Foerster / LLP
Toray Composites (America), Inc.
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