Quick changeover apparatus and methods for wafer handling

Material or article handling – Apparatus for moving material between zones having different...

Reexamination Certificate

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Details

C414S414000, C414S805000, C414S941000, C269S903000

Reexamination Certificate

active

07955041

ABSTRACT:
Quick changeover apparatus for wafer handlers capable of handling at least two sizes of wafer frames and methods of using such apparatus are disclosed.

REFERENCES:
patent: 5725728 (1998-03-01), Fuke et al.
patent: 6074154 (2000-06-01), Ueda et al.
patent: 6851170 (2005-02-01), Lappen et al.
patent: 7074646 (2006-07-01), Kim
patent: 7578647 (2009-08-01), Elliott et al.
patent: 05-067670 (1993-03-01), None
patent: 102002-0042203 (2002-06-01), None
patent: 10-2003-0014860 (2003-02-01), None
patent: 10-2006-0099981 (2006-09-01), None
Shinkawa Ltd., “Shinkawa's Equipment Die Bonder,” no date [retrieved on Aug. 29, 2007]. Retrieved from the Internet:< URL: http://www.shinkawa.com> (1 page).
Micron Technology, Inc., “Semiconductor Manufacturing: Fabrication,” bearing copyright 2006 [retrieved on Aug. 29, 2007]. Retrieved from the Internet:< URL: http://www.micron.com> (1 page).
Micron Technology, Inc., “Semiconductor Manufacturing: Photolithography,” bearing copyright 2006 [retrieved on Aug. 29, 2007]. Retrieved from the Internet:< URL: http://www.micron.com> (1 page).
Micron Technology, Inc., “Semiconductor Manufacturing: Implant,” bearing copyright 2006 [retrieved on Aug. 29, 2007]. Retrieved from the Internet:< URL: http://www.micron.com> (1 page).
Micron Technology, Inc., “Semiconductor Manufacturing: Probe-Quality Control,” bearing copyright 2006 [retrieved on Aug. 29, 2007]. Retrieved from the Internet:< URL: http://www.micron.com> (1 page).
Micron Technology, Inc., “Semiconductor Manufacturing: Assembly,” bearing copyright 2006 retrieved on Aug. 29, 2007]. Retrieved from the Internet:< URL: http://www.micron.com> (2 pages).
Micron Technology, Inc., “Semiconductor Manufacturing: Test/Burn-In,” bearing copyright 2006 [retrieved on Aug. 29, 2007]. Retrieved from the Internet:< URL: http://www.micron.com> (1 page).
Shinkawa Ltd., “Shinkawa Ltd. Annual Report 2002,” Mar. 31, 2002, [retrieved on Aug. 29, 2007]. Retrieved from the Internet:< URL: http://www.shinkawa.com> (32 pages).

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