Semiconductor device manufacturing: process – Miscellaneous
Reexamination Certificate
2005-03-22
2005-03-22
Smith, Matthew (Department: 2825)
Semiconductor device manufacturing: process
Miscellaneous
C065S017300
Reexamination Certificate
active
06869898
ABSTRACT:
An object of the present invention is to provide a quartz glass jig, which, when employed in a processing apparatus using plasma, is less in generation of abnormal etching and particles and low in contamination with impurities. This object is obtained by a quartz glass jig for a processing apparatus using plasma, wherein a surface of the jig is subjected to grinding or a sandblast processing and has a surface roughness Rain the range of from 2 μm to 0.05 μm, and microcracks of grinding marks formed during the grinding or sandblast processing have a depth of 50 μm or less.
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Inaki Kyoichi
Kimura Hiroyuki
Segawa Tohru
Watanabe Naoto
Heraeus Quarzglas GmbH & Co. KG
Malsawma Lex H.
Shin-Etsu Quartz Products Co. Ltd.
Smith Matthew
Tiajoloff & Kelly
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