Quartz glass jig for processing apparatus using plasma

Semiconductor device manufacturing: process – Miscellaneous

Reexamination Certificate

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C065S017300

Reexamination Certificate

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06869898

ABSTRACT:
An object of the present invention is to provide a quartz glass jig, which, when employed in a processing apparatus using plasma, is less in generation of abnormal etching and particles and low in contamination with impurities. This object is obtained by a quartz glass jig for a processing apparatus using plasma, wherein a surface of the jig is subjected to grinding or a sandblast processing and has a surface roughness Rain the range of from 2 μm to 0.05 μm, and microcracks of grinding marks formed during the grinding or sandblast processing have a depth of 50 μm or less.

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