Quantum efficiency enhancement for CMOS imaging sensor with...

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is

Reexamination Certificate

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C257S012000, C257S014000

Reexamination Certificate

active

07038232

ABSTRACT:
The present invention is a CMOS image sensor and its method of fabrication. This invention provides an efficient structure to improve the quantum efficiency of a CMOS image sensor with borderless contact. The image sensor comprises a N-well/P-substrate type photodiode with borderless contact and dielectric structure covering the photodiode region. The dielectric structure is located between the photodiode and the interlevel dielectric (ILD) and is used as a buffer layer for the borderless contact. The method of fabricating a high performance photodiode comprises forming a photodiode in the n-well region of a shallow trench, and embedding a dielectric material between the ILD oxide and the photodiode having a refraction index higher than the ILD oxide.

REFERENCES:
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patent: 6130422 (2000-10-01), Bawolek et al.
patent: 6258712 (2001-07-01), Wang
patent: 6372603 (2002-04-01), Yaung et al.
patent: 6406987 (2002-06-01), Huang
patent: 6946352 (2005-09-01), Yaung
patent: 2002/0089004 (2002-07-01), Rhodes

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