Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work
Patent
1989-11-03
1991-01-15
Heinrich, Sam
Metal fusion bonding
Means to apply vibratory solid-state bonding energy to work
228 9, B23K 2010, H01L 21607
Patent
active
049847309
ABSTRACT:
An automatic wire bonding apparatus, for wedge-bonding using aluminium wire, comprises a bonding head comprising a bonding tool mounted on an ultrasonic transducer, a bonding tip of the tool being arranged, in the operation of the machine, to press aluminium wire against the contact surface of an electronic or electrical component, the wire being drawn from a suitable wire supply, and a wire clamp by which the wire drawn from the wire supply may be clamped, the wire clamp being movable backward and forward generally in the direction in which the wire is fed appropriately to position the free end of wire drawn from the spool after completion of a bonding operation. The automatic wire-bonding apparatus further comprises means for monitoring, during bonding, the quality of the bond formed between the wire and the surface to which it is to be bonded, by identifying those bonds which do not fall within predetermined maximum and minimum values for deformation of the wire due to ultrasonic excitation. By using the automatic wire bonding apparatus described, the time during which ultrasonic energy is transmitted to the bond is minimized, thus maximizing the throughput of the machine, and wastage due to unsatisfactory bond formation is reduced.
REFERENCES:
patent: 4746051 (1988-05-01), Peter
patent: 4789095 (1988-12-01), Kobayashi
Gobel Bernd
Ziemann Andreas
Emhart Inc.
Heinrich Sam
Smith Spencer T.
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