Quad-24JW surface mount package

Equipment for production – distribution – or transformation of ene – Distribution – modification or control – Semiconductor – transistor or integrated circuit

Design Patent

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Design Patent

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D0560623

CLAIM:
The ornamental design for quad-24JW surface mount package, as shown and described.

REFERENCES:
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patent: D467231 (2002-12-01), Harnden et al.
patent: D467560 (2002-12-01), Harnden et al.
patent: D467884 (2002-12-01), Williams et al.
patent: D467885 (2002-12-01), Harnden et al.
patent: 7057273 (2006-06-01), Harnden et al.

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