Pyrophosphoric acid bath for use in copper-tin alloy plating

Details Pyrophosphoric acid bath for use in copper-tin alloy plating Pyrophosphoric acid bath for use in copper-tin alloy plating

2006-12-19

2006-12-19

McNeil, Jennifer C. (Department: 1775)

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

C106S001260, C428S646000, C428S647000, C428S648000

Reexamination Certificate

active

07150781

ABSTRACT:
The invention relates to a pyrophosphoric acid bath for use in cyanogen-free copper-tin alloy plating that contains an additive (A) composed an amine derivative, an epihalohydrin and a glycidyl ether compound with ratios of epihalohydrin to glycidyl ether compound being 0.5–2 to 0.1–5 on mol basis, per 1 mol of the amine derivative, has a pH of 3 to 9, and optionally contains an additive (B) composed of an organic sulfonic acid and/or an organic sulfonic acid salt, and to a copper-tin alloy coating obtainable by using the bath. The invention provides a pyrophosphoric acid bath for use in copper-tin alloy plating of the cyanogen-free type utilizable on an industrial scale, particularly, capable of performing uniform treatment to exhibit low defective product generation rates even with the current density being incessantly changing between a high state and a low state, as a barrel plating method, and a copper-tin alloy coating obtainable by using the bath.

REFERENCES:
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EPO, “Notification of Transmittal of The ISR (PCT/ISA/220) and ISR (PCT/ISA/210),” EPO (Rijswijk), (Mar. 4, 2005).

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