Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1980-02-04
1982-04-27
Weidenfeld, Gil
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228180A, H01L 2158
Patent
active
043266630
ABSTRACT:
A pyroelectric detector comprising a wafer of pyroelectric material, means for collecting electrical charge indicative of energy absorbed by the wafer, electrical means for removing and processing the collected charge, a base defining at least one supporting surface, and a flexible suspension for supporting the wafer in spaced relation to the supporting surface. The suspension includes a plurality of link elements each in the form of a thin metal wire fixed to the supporting surface and to a surface of the wafer and located around the periphery of the wafer. Each link preferably has a shape like an arch with both ends fixed to the supporting surface and the wafer surface fixed to the arch between the ends thereof. The link elements have sufficient strength to hold the wafer in spaced relation to the supporting surface, and the links have sufficient flexibility to absorb shock and vibration forces and to compensate for different coefficients of thermal expansion of said wafer and said supporting surface.
REFERENCES:
patent: 3449642 (1969-06-01), Ortner et al.
patent: 3513312 (1970-05-01), Weiner
patent: 4183126 (1980-01-01), Ikeno et al.
patent: 4218620 (1980-08-01), Dettel
ELTEC Instruments, Inc.
Ramsey K. J.
Weidenfeld Gil
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