Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate
2005-08-09
2005-08-09
Talbot, Brian K. (Department: 1762)
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
C427S097200, C427S097700, C427S097800, C427S097900, C427S304000, C427S307000, C427S437000
Reexamination Certificate
active
06926922
ABSTRACT:
A process and composition for manufacturing printed wiring boards that reduces or eliminates the problem of depositing electroless nickel in through holes that are not designed to be metal plated is provided. Also provided by the present invention is a method and composition for depositing a final finish that is even and bright. The present invention is particularly suitable for the manufacture of printed circuit boards containing one or more electroless nickel-immersion gold layers.
REFERENCES:
patent: 3775121 (1973-11-01), Sharp
patent: 4975159 (1990-12-01), Dahms
patent: 5948533 (1999-09-01), Gallagher et al.
patent: 6284309 (2001-09-01), Bishop et al.
patent: 6533849 (2003-03-01), Fang
patent: 2002-069656 (2002-03-01), None
Cheng Pit Kai Peter
Lai Willetta
Leung Mei Kiu
Wong Cecilia Po Sze
Cairns S. Matthew
Shipley Company L.L.C.
Talbot Brian K.
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