Purification of cyanide-free copper plating baths

Liquid purification or separation – Processes – Making an insoluble substance or accreting suspended...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

204DIG13, B01D 2100

Patent

active

052662128

ABSTRACT:
A process by which organo phosphonate and cupric ions may be removed from an electroplating bath containing contaminants. Excess acetate salt content causes precipitation of a copper/organo phosphonate (HEDP) precipitate which may be removed leaving the contaminants in solution.

REFERENCES:
patent: 3025189 (1962-03-01), Arden
patent: 3095380 (1963-06-01), Arden
patent: 3360447 (1967-12-01), Svatek et al.
patent: 3658470 (1972-04-01), Zievers et al.
patent: 3666447 (1972-05-01), Saubestre
patent: 3706634 (1972-12-01), Kowalski
patent: 3706635 (1972-12-01), Kowalski
patent: 3833486 (1974-09-01), Nobel et al.
patent: 3914162 (1975-10-01), Kowalski
patent: 3928147 (1975-12-01), Kowalski
patent: 4072605 (1978-02-01), Thelander
patent: 4107011 (1978-08-01), Kucherenko et al.
patent: 4144149 (1979-03-01), Bollhalder et al.
patent: 4162217 (1979-07-01), Herrmann
patent: 4352786 (1982-10-01), Hoh et al.
patent: 4462874 (1984-07-01), Tomaszewski et al.
patent: 4469569 (1984-09-01), Tomaszewski et al.
patent: 4600699 (1986-07-01), Courduvelis
patent: 4762601 (1988-08-01), Krulik et al.
patent: 4933051 (1990-06-01), Kline
patent: 5006262 (1991-04-01), Weyls et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Purification of cyanide-free copper plating baths does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Purification of cyanide-free copper plating baths, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Purification of cyanide-free copper plating baths will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2093171

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.