Purging apparatus and purging method

Fluent material handling – with receiver or receiver coacting mea – Diverse fluid containing pressure filling systems involving... – Gas treatment

Reexamination Certificate

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Details

C141S004000, C141S048000, C141S051000, C141S098000, C206S710000, C414S291000, C414S935000

Reexamination Certificate

active

07654291

ABSTRACT:
It is an object of the present invention to easily and securely perform the removal operation of contaminant or the like from a wafer housed in a FOUP. To achieve the object, a purging apparatus of the present invention removes contaminant or the like from a wafer by moving a gas supply nozzle along a direction in which wafers are superimposed at the front of an opening while a lid of the FOUP is separated from a body and spraying clean gas on each wafer from the gas supply nozzle.

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U.S. Appl. No. 11/563,869, filed Nov. 28, 2006, Okabe.
U.S. Appl. No. 11/563,863, filed Nov. 28, 2006, Okabe.

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