Purge apparatus for integrated circuit test system

Details Purge apparatus for integrated circuit test system Purge apparatus for integrated circuit test system

1995-10-12

1997-06-10

Gutierrez, Diego F. F.

Thermal measuring and testing

Thermal testing of a nonthermal quantity

Of susceptibility to thermally induced deteriouration, flaw,...

738656, G01N 2500

Patent

active

056369247

ABSTRACT:
A purge head is provided for use with an integrated circuit test system to direct purge gases, such as nitrogen, to a circuit board on which a device under test is mounted while the device is subjected to below freezing temperatures. The purge head fits into the inner ring or aperture of the product load board to dispense the purge gases directly onto the circuit board on which the device under test is mounted to prevent moisture buildup during cold testing of the device under test.

REFERENCES:
patent: 5193910 (1993-03-01), Kinoshita
patent: 5318361 (1994-06-01), Chase et al.

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