Punch type substrate strip

Details Punch type substrate strip Punch type substrate strip

2007-01-31

2010-02-16

Purvis, Sue (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257SE23055

Reexamination Certificate

active

07663208

ABSTRACT:
A punch type substrate strip includes a plurality of substrate units, a plurality of slots and at least one plating-trace collecting hole. The slots are formed around the substrate units. The plating-trace collecting hole is located outside the substrate units. The substrate strip is provided with a plurality of connecting pads, a plurality of first plating traces and at least one second plating trace. The connecting pads are disposed in each substrate unit, and the first plating traces and the second plating trace are electrically connected to the connecting pads. The first plating traces have a plurality of first broken ends located in the slots. The second plating trace is extended across a region located between the slots, and has a second broken end located in the plating-trace collecting hole. Accordingly, more extensive space for plating traces can be provided.

REFERENCES:
patent: 6262473 (2001-07-01), Hashimoto
patent: 152189 (2001-03-01), None
patent: 1246380 (2004-06-01), None

Affiliated with

Also associated with

Rating

Punch type substrate strip does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Punch type substrate strip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Punch type substrate strip will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4232467