Pump structures integral to a fluid filled heat transfer...

Details Pump structures integral to a fluid filled heat transfer... Pump structures integral to a fluid filled heat transfer...

2007-03-16

2010-02-23

Gandhi, Jayprakash N (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080400, C417S424100, C257S714000

Reexamination Certificate

active

07667969

ABSTRACT:
Presented is a heat sink arrangement, incorporating a fluid media, which transfers heat between stationary and movable objects. Included are pump structures which are designed to be or operate integrally with the fluid-filled heat transfer apparatus, and are adapted to provide optimum and unique cooling flow paths for implementing the cooling of electronic devices, such as computer chips or the like, that require active cooling action. The pumps and heat sink arrangements selectively possess either rotating or stationary shafts, various types of impeller and fluid or cooling media circulation structures, which maximize both the convective and conductive cooling of the various components of the electronic devices or equipment by means of the circulating fluid.

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