Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-10-09
2007-10-09
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S719000, C257S714000, C165S080400, C174S015100, C415S177000
Reexamination Certificate
active
11084654
ABSTRACT:
In one embodiment of the invention, a pump includes a pump housing, an impeller, and a motor. The pump housing has a pump chamber and a heat receiving plate to couple to a heat generating unit, such as a CPU. The impeller is provided in the pump chamber. The motor couples to the impeller to rotate it. A region of the heat receiving plate projects further outward than other regions to couple the heat receiving plate to the IC chip.
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Hata Yukihiko
Tomioka Kentaro
Blakely Sokoloff Taylor & Zafman LLC
Chervinsky Boris
Kabushiki Kaisha Toshiba
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