Pulsed thermal monitor

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Details

C702S130000, C713S322000

Reexamination Certificate

active

07034556

ABSTRACT:
A power solid-state device is pulsed from a controlled pulse source, which generates heat in the chip. Similar or identical pulses are applied to a software or equivalent electrical hardware temperature simulator, for predicting the chip temperature. The output of the simulator is monitored, and the controlled pulse source is inhibited in the event that the predicted chip temperature exceeds a limit. A delay may be introduced between the pulse generation and application to the chip. Additional temperatures associated with the chip heat sink may be combined with the chip temperature.

REFERENCES:
patent: 5557551 (1996-09-01), Craft
patent: 6487668 (2002-11-01), Thomas et al.
patent: 6557072 (2003-04-01), Osborn
patent: 6650132 (2003-11-01), Pelissier
patent: 6704876 (2004-03-01), Iacobovici et al.
Dr. Martin Marz, Paul Nance, Infineon Technologies AG, Munich,Thermal Modeling of Power-Electronic Systems, pp. 1-20, (date unavailable).

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