Pulsed plate plasma implantation system and method

Details Pulsed plate plasma implantation system and method Pulsed plate plasma implantation system and method

1996-10-10

1997-08-05

Pianalto, Bernard

Coating processes

Direct application of electrical, magnetic, wave, or...

Ion plating or implantation

118 501, 118620, 118723R, 118723MP, 118723E, 204164, 427255, 427444, 427523, 427524, 427534, 427535, 427547, 427571, 427572, 427574, 427578, C23C 1414

Patent

active

056540434

ABSTRACT:
Method and apparatus for treating a workpiece implantation surface by causing ions to impact the workpiece implantation surface. An implantation chamber defines a chamber interior into which one or more workpieces can be inserted. A support positions one or more workpieces within an interior region of the implantation chamber so that implantation surfaces of the workpieces are facing the interior region. A dopant material in the form of a gas is injected into the implantation chamber to cause the gas to occupy a region of the implantation chamber in close proximity to the one or more workpieces. A plasma of implantation material is created within the interior region of the implantation chamber. First and second conductive electrodes positioned within the implantation chamber include conductive surfaces in proximity to the chamber interior occupied by the one or more workpieces. A voltage source outside the chamber relatively biases the first and second conductive electrodes. A control circuit utilizes the voltage source for repeatedly relatively biasing the first and second conductive electrodes to energize the electrodes with a sequence of pulses that both ionize the gas molecules injected into the chamber and accelerate the ionized gas molecules toward the implantation surfaces of the one or more workpieces.

REFERENCES:
patent: 4434036 (1984-02-01), Hoerschelmann et al.
patent: 4764394 (1988-08-01), Conrad
Cheung, Nathan W., "Plasma Immersion Ion Implantation for ULSI Processing", Nuclear Instruments and Methods in Physics Research, B55, pp. 811-820 (1991). (No month avail.).
Hinson, Dr. David C., The Basics of Plasmas, Materials Research Corporation, pp. I-1 to I-36 (1984). (no month avail.).
Lieberman, Michael A., et al., Principles of Plasma Discharges and Materials Processing, John Wiley & Sons, Inc., pp. 526-539 (1994). (no month available).

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