Pulsed plasma process for treating a substrate

Details Pulsed plasma process for treating a substrate Pulsed plasma process for treating a substrate

1987-11-03

1989-04-25

Childs, Sadie

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 451, B05D 306

Patent

active

048246905

ABSTRACT:
In a pulsed radio frequency plasma deposition process the pulse repetition frequency is matched to the gas exchange rate. This is achieved by using a pulse width of 50 to 500 microseconds and a pulse repetition rate corresponding to the time within which gas is exchanged in the reaction region.

REFERENCES:
patent: 3108900 (1963-10-01), Papp
patent: 4382100 (1983-05-01), Holland
patent: 4422897 (1983-12-01), Horwitz
patent: 4500563 (1985-02-01), Ellenberger et al.
patent: 4510172 (1985-04-01), Ray
patent: 4532150 (1985-07-01), Endo et al.

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