Pulsed-force chemical mechanical polishing

Details Pulsed-force chemical mechanical polishing Pulsed-force chemical mechanical polishing

1994-08-02

1996-10-08

Rachuba, Maurina T.

Abrading

Abrading process

Utilizing fluent abradant

451 41, 451272, B24B 100

Patent

active

055625304

ABSTRACT:
A pulsed-force CMP scheme allows for the down force holding a wafer onto a pad to cycle periodically between minimum and maximum values. When the force is near its minimum value, slurry flows into the space between the wafer and the pad. When the force is near its maximum value, slurry is squeezed out allowing for the abrasive action of the pad surface to erode wafer surface features.

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