Pull testing electrical device leads

Details Pull testing electrical device leads Pull testing electrical device leads

1982-06-03

1984-06-12

Ciarlante, Anthony V.

Measuring and testing

Specimen stress or strain, or testing by stress or strain...

By loading of specimen

G01N 308

Patent

active

044534140

ABSTRACT:
The bond strength of electrical leads (12) bonded to a device (13), such as a silicon integrated circuit chip, is tested by mounting the device (13) onto a pedestal (22) and then pulling on such lead with a freely manipulatable grasping tool (52). The pedestal (22) is coupled to a load sensitive mechanism, such as a simple balance arm (19), or a movable element (21) coupled to a load cell (56). Such mechanism is adjusted to register that part of the pulling force exerted by the grasping tool (52), which is transmitted through the interface between the lead (12) and the device (13).

REFERENCES:
patent: 670296 (1901-03-01), Richardson
patent: 3564911 (1971-02-01), Slemmons et al.
patent: 3572108 (1971-03-01), McShane et al.
patent: 3678740 (1972-07-01), Schmid et al.
patent: 3786885 (1974-01-01), Mills
patent: 3793880 (1974-02-01), Sugi et al.
patent: 4282759 (1981-08-01), Merrell
patent: 4292852 (1981-10-01), Morris

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