Pt/PGO etching process for FeRAM applications

Semiconductor device manufacturing: process – Having magnetic or ferroelectric component

Reexamination Certificate

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C438S381000

Reexamination Certificate

active

07041511

ABSTRACT:
A method of etching a noble metal top electrode on a ferroelectric layer while preserving the ferroelectric properties of the ferroelectric layer and removing etching residue includes preparing a substrate; depositing a barrier layer on the substrate; depositing a bottom electrode layer on the barrier layer; depositing a ferroelectric layer on the bottom electrode layer; depositing a noble metal top electrode layer on the ferroelectric layer; depositing an adhesion layer on the top electrode layer; depositing a hard mask layer on the adhesion layer; patterning the hard mask; etching the noble metal top electrode layer in an initial etching step at a predetermined RF bias power, which produces etching residue; and over etching the noble metal top electrode layer and ferroelectric layer at an RF bias power lower than that of the predetermined RF bias power to remove etching residue from the initial etching step.

REFERENCES:
patent: 5453305 (1995-09-01), Lee
patent: 5854104 (1998-12-01), Onishi et al.
patent: 6420740 (2002-07-01), Zhang et al.
patent: 6593228 (2003-07-01), Weinrich et al.
patent: 2003/0143800 (2003-07-01), Hall et al.
patent: 2004/0157459 (2004-08-01), Ying et al.

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