Pseudocross-linking resin composition, molded materials,...

Details Pseudocross-linking resin composition, molded materials,... Pseudocross-linking resin composition, molded materials,...

2005-06-07

2005-06-07

Peng, Kuo-Liang (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C525S222000, C525S233000

Reexamination Certificate

active

06903160

ABSTRACT:
The invention provides a pseudo cross-link resin composition comprises at least tow polymer molecules; wherein the resin is obtained by mixing a vinylic polymer molecule A that has an atomic group capable of forming an intermolecular hydrogen bond in a molecular side chain and/or at a molecular tail end of the polymer molecule, and a vinylic polymer molecule B that has an atomic group capable of forming an intermolecular hydrogen bond in a molecular side chain and/or in a molecular skeleton of the polymer molecule; wherein the vinylic polymer molecule A is a polymer and/or copolymer that has a carboxyl group or a hydroxyl group in a molecular side chain and/or at a molecular tail end, and the vinylic polymer molecule B is a polymer and/or copolymer having at least one or more nitrogen atom in a molecular side chain and/or a molecular skeleton; wherein the vinylic polymer molecule A and the vinylic polymer molecule B are mixed together, the intermolecular hydrogen bond is formed therebetween, and adding a silicone resin that has a structure represented by the formula 1.(wherein R is CpH2p+1, p is an integer of 4 or less, and n and m are integers representing the degree of polymerization.

REFERENCES:
patent: 6512051 (2003-01-01), Chino et al.
patent: 58-167605 (1983-10-01), None
patent: 03-52910 (1991-03-01), None
patent: 2000-129173 (2000-05-01), None
patent: 2000-273319 (2000-10-01), None
patent: 2002-038036 (2002-02-01), None
patent: 2002-105344 (2002-04-01), None
International Search Report for PCT/JP02/05537 dated Sep. 17, 2002.

Affiliated with

Also associated with

Rating

Pseudocross-linking resin composition, molded materials,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pseudocross-linking resin composition, molded materials,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pseudocross-linking resin composition, molded materials,... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3466744