Proximity sensitive defect monitor

Details Proximity sensitive defect monitor Proximity sensitive defect monitor

2006-11-29

2009-02-03

Nguyen, Vincent Q (Department: 2831)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S1540PB, C438S018000

Reexamination Certificate

active

07486097

ABSTRACT:
The invention relates to a method for determining processing image induced defects in the manufacture of semiconductor products such as wafers by analyzing the circuit design of the product mask and modifying a conventional test defect structure to mimic the product mask to incorporate one or more isolated or other features including product mask circuit features likely to cause processing image induced defects into the test defect structure.

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Semiconductor Product Yield Analysis Test Site; N.E. Hallas, R.F. Levine and C.H. Scriyner; IBM Technical Disclosure Bulletin, vol. 20, No. 8, Jan. 1978, p. 3099-3100.

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