Proximity printing method

Photocopying – Contact printing – Methods

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355 76, 355 77, 355 91, G03B 2702

Patent

active

040266532

ABSTRACT:
A predetermined small spacing or gap between a semiconductor wafer and a mask is defined by projecting a cushion of air through a central mask aperture toward the wafer. The wafer is supported on a sponge rubber member which is designed, along with the air flow paths, to maintain a uniform small separation as is desirable in the photolithographic printing of semiconductor mask patterns.

REFERENCES:
patent: 1209419 (1916-12-01), Farguhar
patent: 3103850 (1963-09-01), Khoury et al.
patent: 3151521 (1964-10-01), Atkin et al.
patent: 3204544 (1965-09-01), Shannon
patent: 3519348 (1970-07-01), McLaughlin
patent: 3619056 (1971-11-01), Hantusch et al.
patent: 3676002 (1972-07-01), Moreau et al.
patent: 3741650 (1973-06-01), Leavitt et al.
patent: 3771872 (1973-11-01), Nightingale et al.
Schaible, P. M., "Dimension Control of Photolithographically Produced Patterns," I.B.M. Technical Disclosure Bulletin, vol. 8, No. 11, April 1966, p. 1575.

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